| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-106 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-32 |
| filingDate |
2001-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c339835e54b9ac11cfa29315b963e62e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79e2ed24c157ff01d2f53b9f3c7f9de6 |
| publicationDate |
2003-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6649322-B2 |
| titleOfInvention |
Positive resist composition and positive resist base material using the same |
| abstract |
A positive resist composition comprising: (A) a compound which generates an acid upon irradiation with active light or radiant ray, and (B) a resin which exhibits increased solubility in an alkali by action of an acid and includes a copolymer including (b-1) 40% to 85% by mole of a unit having an alkali-soluble group, (b-2) 3% to 25% by mole of a unit having (i) an acid-decomposable dissolution-inhibiting group and (ii) a group which accelerates dry-etching resistance, and (b-3) 3% to 40% by mole of a unit having an acid-decomposable dissolution-inhibiting group and being other than the units (b-1) and (b-2). This composition is a chemically amplified positive resist composition that can be applied to a resist having a reduced thickness, is excellent in dry-etching resistance and definition and can form a patterned resist with a good sectional shape. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7422839-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007099107-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005164123-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7727701-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008241747-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7250246-B2 |
| priorityDate |
2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |