| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b4116e3af92cf221612a2521f92b3e87 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49789
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4916
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2001-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bb00ad544c8374f667d4883b6b9c3bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8983c1ca3d1aeacc9f46801496916e3 |
| publicationDate |
2003-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6635829-B2 |
| titleOfInvention |
Circuit board having side attach pad traces through buried conductive material |
| abstract |
A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8021965-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8623700-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7608919-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7612443-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620473-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10410989-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007244415-A1 |
| priorityDate |
1998-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |