| abstract |
A heat dissipating assembly for electronic components mounted on a circuit board includes a first thermal plate ( 10 ), a second thermal plate ( 30 ), and a copper adjusting screw ( 60 ). The first thermal plate forms a plurality of offset portions ( 12 ) and thereby defines a plurality of recesses at the offset portions respectively. Depths of the recesses correspond to heights of the electronic components. The first and second thermal plates are secured to opposite sides of the circuit board. The first and second thermal plates respectively define first and third holes ( 14, 32 ) movably receiving the adjusting screw therein. The adjusting screw is tightened so that it improves thermal contact between the offset portions and the electronic components. Because the adjusting screw is made of highly heat conductive material, heat in the first thermal plate is conducted to the second thermal plate through the adjusting screw. |