| abstract |
An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste ( 4 ) is supplied to electrodes ( 2 ) for receiving surface-mount components ( 40 ), and the surface-mount components ( 40 ) are provisionally fixed on the electrodes ( 2 ) with the high-temperature solder paste ( 4 ). In addition, flux ( 5 ) is applied to an electrode ( 1 ) for receiving an IC ( 30 a ) that is provided with eutectic solder bumps ( 31 ) or on the eutectic solder bumps ( 31 ), and the IC ( 30 a ) is provisionally fixed on the electrode ( 1 ) with the flux ( 5 ). Then, a wiring substrate ( 10 ) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components ( 40 ) and the IC ( 30 a ) are reflow-soldered. |