| abstract |
A semiconductor device includes a passivation film ( 19 ) having opening portions through which an electrode pads ( 18 ) formed on a semiconductor chip ( 21 ) are exposed, projecting electrode portions ( 20 ) whose one end faces are connected to the electrode pads ( 18 ) through the opening portions, post electrode portions ( 16 A) through which the other end faces of the projecting electrode portions ( 20 ) and the metal bumps ( 26 ) are connected to each other, and an insulating resin layer ( 13 ) having elasticity which covers the post electrode portions ( 16 A), the projecting electrode portions ( 20 ) and the passivation film ( 19 ) with the exception of the end faces of the post electrode portions ( 16 A). |