abstract |
A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising(A) a compound having oxetane ring,(B) a photoinitiator for cationic polymerization and(C) a silane coupling agent,wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C. |