patent/US-6543131-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6543131-B1

Outgoing Links

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filingDate	2000-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf4c79a8f03e35df0ba1acfe7e1a728f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2d476f95604154b504407976e4f435f
publicationDate	2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6543131-B1
titleOfInvention	Microelectronic joining processes with temporary securement
abstract	A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Conductive features of the elements are connected to conductive features of the components and the temporary securements are released.
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priorityDate	1999-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 126.