Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2111-00844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0514 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-5127 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
filingDate |
2001-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2003-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf79d051c9c69534212b3f8f914dfa51 |
publicationDate |
2003-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6531257-B2 |
titleOfInvention |
Photosensitive copper paste and method of forming copper pattern using the same |
abstract |
Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 mum from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007275502-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9089993-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8298754-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003036020-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8053890-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8819932-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012018205-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8178192-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7087357-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009226685-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007224534-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004154726-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6806028-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008130257-A1 |
priorityDate |
2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |