| abstract |
The present invention discloses a thermally conductive adhesive composition that is useful for encapsulating electronic parts. More particularly, this invention provides adhesive compositions that have 90% of the alumina particles having an average diameter sufficiently low to maintain the particles in suspension. The thermally conductive compositions of the present invention have a low viscosity and excellent thermal conductivity properties. Also contemplated is an electronic part that is encapsulated with the inventive composition, an article of manufacture having a container with the inventive composition contained therein and a method of manufacturing the inventive thermally conductive adhesive composition. |