| abstract |
A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout. Power pack cover is attached to the cold side of the mounting frame, encapsulating the electrical components and creating a non-planar barrier between the hot side and the cold side of the TEC. The TEC includes several moisture resistant barriers and thermally isolating barriers to improve performance and longevity. A moisture resistant barrier is provided around at least one thermoelectric module and around a power supply assembly. A non-planar thermally isolating barrier is provided between the hot side and cold side of the TEC. A power control system is provided to deliver maximum cooling power for a given design and a give set of operating conditions. Finally, a dual power supply may be provided to increase reliability. |