http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6492255-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11902
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
filingDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af06aa8ab5d35f1e0514a3bef69d8b30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d22728f727f41aeb7913b1a388383b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af1b4b62738d57b1cbb54bd680f36b36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ca1d95ddfb15d703f987763b76f7d3b
publicationDate 2002-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6492255-B2
titleOfInvention Semiconductor chip and method manufacturing the same
abstract A via 42 is formed by copper plating on a surface of an aluminum electrode pad 32 of a semiconductor chip 30 . Since the via 42 having flexibility absorbs a stress generated due to a difference in thermal expansion between the semiconductor chip 30 and a substrate, the semiconductor chip 30 can be mounted onto the substrate 50 with high reliability and connection reliability of the semiconductor chip 30 can be enhanced.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003111739-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9754907-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232194-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8643186-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8283778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8093729-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8154131-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8072070-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011233750-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8368213-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008157338-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7989958-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9324629-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8197626-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7579268-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7253510-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9159665-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7969015-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7915737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010219503-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8053903-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004140560-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9111787-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8021922-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010304565-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10340239-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8084851-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009261473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006160346-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013026628-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8456015-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8197627-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8153516-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004141298-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007287225-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8067312-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7816754-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9147635-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6867121-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011291256-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8846445-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011147932-A1
priorityDate 1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3772077-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6370768-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5492863-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5830563-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4613069-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09321049-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09312295-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6051879-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0547768-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4482596-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4167459-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18628414
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128363546

Total number of triples: 120.