| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fba087135a37b5eb404b409d27f1ad9c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3618 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| filingDate |
1999-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e6be145fed63c816467a51359244f63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec6d2f5c284d1fdbe47145da8deb68e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ede4ae75c3a87c7d7439685371f3462e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d8cd79d32063ccef186fd2d595c90c2 |
| publicationDate |
2002-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6488781-B1 |
| titleOfInvention |
Soldering paste, soldering method, and surface-mounted type electronic device |
| abstract |
Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste undergoes a reflow performed in a nitrogen atmosphere. Accordingly, an ester film is formed around the electrodes as a reaction product of the organic acid and the alcohol. The ester film incorporates therein the remaining organic acid and metal salt as its reaction product. As a result, high insulation reliability is provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9490046-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111048428-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111048428-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003189260-A1 |
| priorityDate |
1998-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |