| abstract |
An apparatus for dense chip packaging using heat pipes and thermoelectric coolers is provided. The apparatus includes an evaporator region, a condenser region, and a capillary region. The evaporator region includes one or more hot point elements used to transfer heat from a heat source to a transport fluid. The transport fluid changes state to a vapor when heat is applied to the transport fluid. The vapor travels to the condenser region via vapor channels and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. The condensed fluid is then returned to the evaporator region by way of capillary forces and capillaries formed in a capillary structure. The capillaries formed in the capillary structure have a tree-like or fractal geometry. The apparatus may further include a flexible region that allows the apparatus to be bent around corners and edges. |