| abstract |
An interface have been provided to permit the formation of solder connections between substrates suitable for microwave to millimeter wave frequencies. Specifically, signal traces on the substrate are selectively masked to form solder dams. The high temperature, thick-film solder dams define the bonding area and control the flow of solder. Since the solder dam forms a finite-extent structure, the solder mask minimally overlies the signal trace, and signal propagation through the trace is not degraded. |