| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2d05f400bdfb3dda36ea3a4026b752b9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T403-7069 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16B7-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate |
2000-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38ac0b6006faed3ea58038778b7c166e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4717ccfdd80c62201067af430e70571a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50178a8dc35fd30c3198ac773021d5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3ae93a8bee490b94d0bf44f1be4549a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65e553ed75af9fe5b2b006db14f231f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ec78245c0c1474889b50877bd16fba5 |
| publicationDate |
2002-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6428719-B1 |
| titleOfInvention |
Etching process to selectively remove copper plating seed layer |
| abstract |
Write head coils for magnetic disk systems are commonly formed through electroplating onto a seed layer in the presence of a photoresist mask. It is then necessary to remove the seed layer everywhere except under the coil itself. The present invention achieves this through etching in a solution of ammonium persulfate to which has been added the complexing agent 1,4,8,11 tetraazundecane. This suppresses the reduction of Cu++ to Cu, thereby increasing the dissolution rate of copper while decreasing that of nickel-iron. Two ways of implementing this are described-adding the complexing agent directly to the ammonium persulfate and introducing the 1,4,8,11 tetraazundecane through a dipping process that precedes conventional etching in the ammonium persulfate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108990298-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008041813-A1 |
| priorityDate |
2000-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |