| abstract |
A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by patternwise delivery of heat, comprises a polymer of general formula (I), wherein R 1 represents a hydrogen atom or alkyl group, R 2 represents a hydrogen atom or alkyl group, R 3 represents a hydrogen atom or alkyl group, and R 4 represents hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10. |