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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-00
filingDate 2000-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28742045bba78004a67f3e54e255bfc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc61c1a99230823e82d83778e7c43a97
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publicationDate 2002-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6418007-B1
titleOfInvention Trimmable chip stub
abstract A non-polarized laser trim chip stub in accordance with the invention includes a trimmable top conductor ( 12 ) capable of being trimmed to alter the electrical properties of the chip stub, a bottom conductor ( 58 ) having at least a first conductive portion ( 68 ) and a second conductive portion ( 72 ), a dielectric ( 44 ) separating said top conductor from said bottom conductor, and conductive passages ( 42 ) electrically connecting the top conductor or a portion thereof to the bottom conductor or a portion thereof. In alternate embodiments, the non-polarized laser trim chip stub's top conductor ( 102 ) is separated into a trimmable stub portion ( 110 ) and an end portion ( 112 ), and the bottom conductor ( 150 ) may be separated into three conductive portions ( 160, 162 and 164 ) to allow for the middle portion ( 162 ) to be used as a heat sink to aid in the dissipation of heat generated during high power applications.
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