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filingDate 2000-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91ef886655cddecb1682b4ce0c6bd4c7
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publicationDate 2002-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6406975-B1
titleOfInvention Method for fabricating an air gap shallow trench isolation (STI) structure
abstract A method of manufacturing a shallow trench isolation (STI) with an air gap that is formed by decomposing an organic filler material through a cap layer. A pad layer and a barrier layer are formed over the substrate. The pad layer and the barrier layer are patterned to form a trench opening. We form a trench in substrate by etching through the trench opening. A first liner layer is formed on the sidewalls of the trench. A second liner layer over the barrier layer and the first liner layer. A filler material is formed on the second liner layer to fill the trench. In an important step, a cap layer is deposited over the filler material and the second liner layer. The filler material is subjected to a plasma and heated to vaporize the filler material so that the filler material diffuses through the cap layer to form a gap. An insulating layer is deposited over the cap layer. The insulating layer is planarized. The barrier layer is removed.
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