| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B02C23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
| filingDate |
2000-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9058b6d1822de2e697d61e4d0d043e5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73e7e9b6a403ba7b99d429a2c7cd2dd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f2fb9f7a938b4a25ecc0d518d8fdb59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c4d5ca5bae6c9aef0c61996033b4af5 |
| publicationDate |
2002-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6395452-B1 |
| titleOfInvention |
Photosensitive resin and photosensitive resin composition |
| abstract |
Disclosed is a photosensitive resin which can give a photosensitive resin composition having excellent heat durability and excellent developability and showing excellent heat durability and excellent electric insulation reliability in a humidified state. The photosensitive resin composition contains the above photosensitive resin which is a reaction product produced by reacting an epoxy acrylate with a cyanate ester compound to obtain a reaction product (A) and reacting the reaction product (A) with a polybasic acid anhydride, and an epoxy resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008241529-A1 |
| priorityDate |
1999-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |