| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2000-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc8faf38dd0299cce8c21bee714f1f89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f34bf450ffd70f5148b6f16dc1567f41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87c95d37f8c7bc6c740df43a9c2cdaa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97f5ae4edbc10c4665fa24ca1b814d79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f51fe5601be8d78c88a5f972a1a6cc81 |
| publicationDate |
2002-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6391773-B2 |
| titleOfInvention |
Method and materials for through-mask electroplating and selective base removal |
| abstract |
Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers. Similarly, the alloying or intermixing may be accomplished before or after plating base removal for structures deposited by through-mask plating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9340892-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6784088-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9410261-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005142769-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005118796-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7112851-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6967131-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005095852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006081885-A1 |
| priorityDate |
1997-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |