| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_358a329cc314c43da9d13d9d90a7db83 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B11-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
1999-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea97dc342059b34130964c95cf228920
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c93597b55ef33543a91fdb09a66593ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b6162b798d1e68c834c25762fde34ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a1696a906e24f5dd20294dc319a119a |
| publicationDate |
2002-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6387505-B1 |
| titleOfInvention |
Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board |
| abstract |
The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106459559-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008047743-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013256002-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009314523-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9232636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7015616-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003184180-A1 |
| priorityDate |
1998-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |