| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a34d7d2e0d09a58cb7bf4a04c81162e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2000-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7417551b7537b23729417f70c4a85ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99f0268cdcb45bb9e8184e69fda82844 |
| publicationDate |
2002-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6368697-B1 |
| titleOfInvention |
Method of manufacturing an interlayer via and a laminate precursor useful for same |
| abstract |
A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011127879-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6694612-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7066344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003153197-A1 |
| priorityDate |
1998-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |