| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-274 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1999-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0842b630962ea1d763412ceaab84fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34bbe89d0fb3f2f507c3c14f499b5f3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_825ff3423defa4de5595ff1563dc3f31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cf665b70f80b98542ae3dbe16d754f4 |
| publicationDate |
2002-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6361879-B1 |
| titleOfInvention |
Semiconductor device and method for fabricating it, and semiconductor sealing resin composition |
| abstract |
A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60x10-6/K or less at a temperature equal to or less than its glass transition point and 140x10-6/K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60x10-6/K or less at a temperature equal to or less than its glass transition point and 140x10-6/K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8891154-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004034127-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009002803-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9897889-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10782584-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8345345-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011176195-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7070861-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9454054-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9128345-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6787606-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100863473-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002151627-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6921782-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1139420-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10385203-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9057925-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7884995-B2 |
| priorityDate |
1998-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |