http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6320269-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1999-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59f2e1e43f689a38e3e4ab21be70fc25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efa48f3686cda3554573de107f21ae3c |
| publicationDate | 2001-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-6320269-B1 |
| titleOfInvention | Method for preparing a semiconductor wafer to receive a protective tape |
| abstract | A protective tape is applied to the device side of a wafer (to protect it during an operation to grind the back side of the wafer) after the surface has been prepared to present only sloping surfaces to the tape. This profile prevents the otherwise sharp edges of the holes for the bonding pads from cutting into the adhesive of the tape and causing adhesive particles to remain on the wafer surface after the tape has been removed. Particles of resist can interfere with attaching wires to the bonding pads. The tape receiving surface of the wafer is commonly formed by a passivation layer and by bonding pad sites that are exposed through holes in the passivation layer. These sloping profiles can be formed by giving a sloping profile to the holes in the photoresist before the holes are etched. Alternatively the holes can be etched suitably wider at the top than at the bottom. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7018268-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003211813-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7901490-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007054115-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009180848-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004092108-A1 |
| priorityDate | 1999-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.