| abstract |
The invention relates to a flexible and cost-effective method for fabricating customized rerouting metallization of the circuit contact pads. Localized depositions of insulating as well as conducting paths are provided with the capability for manufacturing multi-layered networks of interconnection. In a gas-filled chamber, either a focused laser, or an unfocussed lased impinging through a mask, is used to locally heat selected areas of the chip surface. The gas decomposes on the heated areas, depositing insulating or conducting material precisely on the heated surface areas, respectively. With this additional flexibility for product design and assembly, a number of interesting new products can now be fabricated which are in demand in both commercial and military markets. |