| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057 |
| filingDate |
2000-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2490472e7a33d0a4eb5eee5b5d670620 |
| publicationDate |
2001-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6291263-B1 |
| titleOfInvention |
Method of fabricating an integrated circuit package having a core-hollowed encapsulation body |
| abstract |
An integrated circuit packaging method is provided for fabriacting an integrated circuit package of the type having a core-hollowed encapsulation body. The provided method includes the steps: preparing a leadframe including a die-bonding area and a wire-bonding area; attaching a tape onto the front side of the leadframe to cover the entire die-bonding area and the wire-bonding area; performing a molding process to thereby form an encapsulation body having a core-hollowed portion; removing the tape to expose the die-bonding area; connecting a set of bonding wires for electrically coupling the semiconductor die to the wire-bonding area of the leadframe; and covering a lid on the opening of the core-hollowed portion of the encapsulation body. Since the entire die-bonding area and the wire-bonding area are covered by the tape during the molding of the encapsulation body, the entire die-bonding area and the wire-bonding area can be prevented from resin flash. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112309872-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8704349-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7652376-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004244192-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106206328-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003178719-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007141238-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8716070-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015515699-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7915717-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7838899-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8309397-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010038737-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007166867-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1971866-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6874227-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9254994-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011018084-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8378502-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7687315-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100444339-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011177643-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007158809-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8021924-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7750482-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7723146-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099294-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6353257-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008112037-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007108298-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011037136-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8420430-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009057799-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7768125-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106206328-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010065936-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7855100-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6511866-B1 |
| priorityDate |
2000-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |