| abstract |
A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads. The free portion is initially fixed to the substrate to intentionally form the inherent stress gradient in the elastic member. The free portion is released from the substrate by etching a release layer deposited on the substrate so the inherent stress gradient in the elastic member biases the free portion away from the substrate. A contact tip of the spring contact can be coated with solder. |