| abstract |
Copper or copper alloy interconnection patterns are formed by a damascene technique. An aluminum or magnesium alloy is deposited in a damascene opening formed in a dielectric layer. Copper or a copper alloy is then electroplated or electroless plated on the aluminum or magnesium alloy, filling the opening. During low temperature annealing, aluminum or magnesium atoms diffuse through the copper or copper alloy layer and accumulate on its surface forming a self-encapsulated oxide to prevent corrosion and diffusion of copper atoms. |