| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate |
1999-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d9b1419b48073b1ae5ac7d3475dc8af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c7e88e9e5e3f0db8c9c77d9eda4f6cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7eba616950aabc690954dbcbaf08594 |
| publicationDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6232221-B1 |
| titleOfInvention |
Borderless vias |
| abstract |
Borderless vias are formed by depositing a hard dielectric mask layer on the upper surface of a lower metal feature and forming sidewall spacers on the side surfaces of the metal feature and mask layer. A dielectric interlayer is deposited and a misaligned through-hole formed therein by etching. The dielectric material of the sidewall spacer and dielectric material of the dielectric interlayer are different. The etchant employed to form the through-hole exhibits a high selectivity with respect to the sidewall spacer material. The dielectric mask layer enables the formation of a sidewall spacer extending above the metal feature such that, after etching to form the misaligned through-hole, the sidewall spacer covers the side surface of the metal feature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6682999-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100446217-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003080432-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005042878-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005051852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005161831-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7259087-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6803300-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7183662-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7176127-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7560353-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007122970-A1 |
| priorityDate |
1997-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |