patent/US-6222738-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6222738-B1

Outgoing Links

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filingDate	1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2001-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_443538224067616ca0f629ff39a82327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dea78eecea94b0fa0330b13f7a18063c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b76035698d6a19eed95207d9420b4a3
publicationDate	2001-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6222738-B1
titleOfInvention	Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof
abstract	A packaging structure of semiconductor elements and for mounting such elements on which high density pads are formed on a board at a high production yield, where bumps or gold wires are bonded in a staggered manner within a pad on a semiconductor element. The spaces between bumps or gold wires can be widened without changing the semiconductor element.
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priorityDate	1997-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 100.