| abstract |
An infrared ray blocking transparent film which can be very thin and have greater transparency and higher adhesion than that of conventional films; the cost for forming the film can be lower due to the reduced amounts of forming materials used for the infrared ray blocking layer, is disclosed. An infrared ray blocking layer is provided on a surface of a base film, by coating conductive materials including indium tin oxide powder and resin; a hard coat layer is provided on a surface of the infrared ray blocking layer; an adhesive layer is provided on a rear surface of the base film. Since resin employed in the infrared ray blocking layer is UV-curing resin including photo-cationic polymerization initiator, thickness of the layer is reduced, and transparency and adhesion thereof are improved. |