Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5101a2a1647a77574f4eb04ad41ea77 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0276 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate |
1999-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c71defdd522eb5d3054aa7427d01cf19 |
publicationDate |
2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6165895-A |
titleOfInvention |
Fabrication method of an interconnect |
abstract |
A method of fabricating an interconnect is described in which a conductive layer, an anti-reflection layer and a cover layer are sequentially formed on the substrate to form a conductive plug with its bottom situated in the anti-reflection layer. The cover layer and a portion of the anti-reflection layer and the conductive layer are remove to form an opening exposing the substrate and to define the conductive lining structures. A conformal polysilicon oxide layer is formed on the substrate and a first dielectric layer is also formed, filling the opening. A conformal isolation layer is then formed on the substrate, followed by forming a second dielectric layer covering the entire substrate. A planarization procedure is further conducted to expose the conductive plug. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6503827-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006141699-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7781895-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6258709-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6689682-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009250818-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006160354-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7691739-B2 |
priorityDate |
1999-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |