| abstract |
A novel slurry for polishing and a method of polishing using a slurry is disclosed. The slurry may include a colloidal silica abrasive in an aqueous solution. The slurry further includes a chelating agent that is believed to remove adsorbed ions from the surface of the layer being polished. The method may be used to polish a surface comprising, for example nickel and the chelating agent may be, for example, ammonium oxalate. |