| abstract |
In one embodiment, the present invention relates to a method of forming a short wavelength thin photoresist coating having a low defect density by depositing sequentially at least two discrete ultra-thin photoresist layers to form the short wavelength thin photoresist coating, each ultra-thin photoresist layer independently having a thickness from about from about 200 Å to about 2,500 Å, the short wavelength thin photoresist coating, having a thickness of about 5,000 Å or less. |