| abstract |
A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880 DEG C., and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, and higher level assemblies including such devices. |