| abstract |
The present invention discloses a method of melt-adhering a hard resin product to a substrate, wherein: a primer which includes a silane coupling agent is applied to a substrate which includes silicon, a hard resin product contacts a portion to which the primer has been applied, and the resin product is vibrated while pressure is applied thereto, and a melt-adhering apparatus which uses this method. A melt-adhering apparatus, comprising: a melt-adhering gun which includes a horn which can hold a resin product; a nipping stand which is movably disposed beneath the horn so that a substrate is nipped between the nipping stand and the horn; moving means which relatively moves the melt-adhering gun and the nipping stand; and a converter which subjects the horn to ultrasonic vibration in response to an input signal. In the present invention, the resin product can be securely melt-adhered to the substrate inexpensively. |