| abstract |
The present invention provides a radically polymerizable curable resin obtained by modifying an epoxy resin by reacting a phenol compound having an alcoholic hydroxyl group; and an unsaturated monobasic acid, to the epoxy resin having two or more epoxy groups in a molecule. The epoxy resin is reacted with the phenol compound and the unsaturated monobasic acid. The curable resin is subjected to polymerization curing with heat or light to form a cured product having excellent heat resistance, moisture resistance, and adhesion to substrates. The present invention also provides a curable resin composition containing the curable resin, as well as an alkaline-developable curable resin capable of forming a coating layer having excellent tack-free property, quick developability and excellent properties of cured layer. |