| abstract |
A method of selectively patterning a structured substrate without using a mask is disclosed. The method includes the steps of providing a surface having a plurality of protrusions, coating the surface with a filler material thick enough so that the protrusions are covered, and planarizing the filler coating. The filler material is thereafter partially removed in a uniform fashion to expose only those portions of the protrusions to be modified. After modifying the protrusions by, for example, deposition or etching, the remaining filler material may be removed, resulting in a structured substrate selectively modified or patterned at its protrusions. |