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filingDate 1997-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2000-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6010965-A
titleOfInvention Method of forming high integrity vias
abstract Aluminum extrusions in overlying vias are prevented by depositing the underlying aluminum layer at a high temperature, preferably at a temperature greater than any temperature to which the wafer is exposed during subsequent processing. Embodiments include sputter depositing the underlying aluminum layer at a temperature of about 430° C. to about 570° C.
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