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filingDate 1996-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6007866-A
titleOfInvention Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
abstract PCT No. PCT/EP96/03134 Sec. 371 Date Mar. 13, 1998 Sec. 102(e) Date Mar. 13, 1998 PCT Filed Jul. 17, 1996 PCT Pub. No. WO97/05758 PCT Pub. Date Feb. 13, 1997The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps: 1) swelling in a per se known treatment liquid and rinsing with water; 2) treatment with alkaline permanganate solution (desmearing); 3) rinsing with water; 4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content); 5) rinsing with water; 6) rinsing with alkaline aqueous solution (pH 8 to 9.5); 7) rinsing with water; 8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst); 9) rinsing with acid (fixation); 10) rinsing with water; 11) coppering; 12) rinsing with water; and 13) drying; 14) usual process steps for creating the printed circuit pattern.
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