| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49888 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
1997-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1999-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29af3aabb01e35ced46a6092fe6ce5b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af2b029888720fda4bfd46303141d72c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5118aca514042947c44b825f1ca4cbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_501423835e85704e5933b59c23990fdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_164efd188d52b943e77f8d5ac38efc25 |
| publicationDate |
1999-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6002951-A |
| titleOfInvention |
Multi-layer ceramic substrate having high TC superconductor circuitry |
| abstract |
A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009233800-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7893006-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009088326-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8389444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10842030-B2 |
| priorityDate |
1997-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |