Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_05a31d15146049253ebe5354fed884ea |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
filingDate |
1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1999-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c520b4bd85321eb9f1428ea63990c04 |
publicationDate |
1999-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-5948705-A |
titleOfInvention |
Method of forming interconnection line |
abstract |
A method of forming an interconnection line of a semiconductor device includes the steps of forming an insulating layer on a substrate, forming a contact hole in the insulating layer, forming a first conductive material layer in the contact hole so that a top surface level of the first conductive material layer is the same as or higher than a top surface level of the insulating layer and so that a portion of the first conductive material layer remains on the insulating layer, and forming a second conductive material layer on the first conductive material layer as the portion of the first conductive material layer remaining on the insulating layer is removed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6783868-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7384862-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6509266-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7192865-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006051969-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7202497-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002000613-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7403238-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004092059-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8440509-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007161236-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7084503-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005134753-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6856360-B1 |
priorityDate |
1996-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |