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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41C1-14
filingDate 1997-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94578fe40b569d441b8c6222ef5315e3
publicationDate 1999-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5924359-A
titleOfInvention Thermoplastic heat-sensitive stencil sheet with a liquid absorbing layer
abstract A heat-sensitive stencil sheet, and a method and a composition for perforating the same are provided, in which photothermal conversion materials transferred to the stencil sheet do not blur or spread but are fixed thereon faithfully to desired images, and clear images are printed. The heat-sensitive stencil sheet has on a side thereof a liquid absorbing layer to which the photothermal conversion material is to be transferred, and the liquid absorbing layer comprises a hydrophilic resin and a water-repellent compound, and optionally organic and/or inorganic particulates. The hydrophilic resin and the water-repellent compound may be mixed at a proportion sufficient to provide a contact angle of 20 to 150 degrees between the liquid absorbing layer and the liquid. The liquid, in which the photothermal conversion material is contained, can comprise water and/or a hydrophilic solvent. The liquid absorbing layer preferably has a softening or melting point of 40 to 120° C. and has a thickness of 0.01 to 20 μm.
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