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filingDate 1996-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1999-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5900286-A
titleOfInvention Method of producing an attenuating structure on a surface wave component
abstract PCT No. PCT/DE95/01738 Sec. 371 Date Jun. 5, 1997 Sec. 102(e) Date Jun. 5, 1997 PCT Filed Dec. 5, 1996 PCT Pub. No. WO96/18182 PCT Pub. Date Jun. 13, 1996An attenuating structure composed of an epoxy resin which cationically cures with UV initiation is proposed for a surface wave component. The solvent-free epoxy resin is based on a cycloaliphatic epoxide and is applied to the wafer by screen printing. When the wafers are sawn up, sawing through can be carried out without detaching or splintering off the attenuating material. Attenuation and corrosion behavior of the attenuating structures fulfill the requirements for surface wave filters.
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