| abstract |
An abrasive composition which can realize chemical-mechanical polishing superior in polishing speed and polishing uniformity. n The abrasive composition comprises abrasive grains, isopropyl alcohol, and water. Grain sizes of the abrasive grains are preferably 30 to 250 nm, and the abrasive grains are preferably SiO 2 . Further, it is preferable that contents of the abrasive grains and isopropyl alcohol are 5 to 30 wt % and 1 to 15 wt %, respectively. The abrasive composition of the present invention is characterized in that it is deaerated. |