| abstract |
A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R1SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c(R3O1/2)din which R1 is an epoxy-functional monovalent organic group, R2 is a monovalent hydrocarbon group, R3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c>/=0. Also, an electronic component coated with a product obtained by curing the aforesaid composition |