http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5891800-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81851e105df9f5a9ad2b0a7c2783bcc0
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-902
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-022
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
filingDate 1997-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a0a6725fd647a9123b0e3fff1d64632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89700164c4fd8d37f2fc7daf447aa080
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fa5dfe545384808cbe53bc1478e2232
publicationDate 1999-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5891800-A
titleOfInvention Method for depositing a flow fill layer on an integrated circuit wafer
abstract An improved method for depositing a flow fill layer of an integrated circuit. Two flowlayers and two cap layers are deposited. The wafer is warmed between the deposition of the first cap layer and the deposition of the second flowlayer, to evaporate water from the first flowlayer. Preferably, each of the cap layers is deposited in two separate steps of plasma enhanced chemical vapor deposition, to inhibit crack formation in the flowlayers. Most preferably, after the depositions of each flowlayer, the flowlayer is planarized by flowing H2O2 thereupon.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7528059-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008026594-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7670961-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6511923-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6429147-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6534396-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100431741-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007232063-A1
priorityDate 1996-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5534731-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5192715-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5003062-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5094984-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5435888-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5395785-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5503882-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5354387-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5364818-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3080755
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450980675

Total number of triples: 41.