| abstract |
A compound and method for dielectrically heating plastic in a mold with an RF source. A novel molding compound includes, in one embodiment, plastic such as polystyrene having a first dielectric constant and a water based resin such as phenolic resin. A lossy additive, such as a chemically inert low dielectric material, having a second dielectric constant substantially lower than that of the plastic, is added to the molding compound. The lossy additive increases the RF energy absorbed by the plastic molding compound thereby reducing heating time in the mold. |