| abstract |
A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: about 40-65% Ag2O about 15-35% V2O5 about 0-30% PbO2 about 0-20% TeO2 The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1. |