| abstract |
A curable composition providing a cured product having a silicon type interpenetrating polymer network, which comprises (A) a silsesquioxane ladder polymer, (B) a silicon compound having at least two SiH groups per molecule, (C) a silicon compound having at least two vinylsilyl groups per molecule and (D) a neutral platinum catalyst; and a process for producing a molded article comprising heating the curable composition under a controlled temperature for synchronously causing hydrolysis and condensation of the alkoxysilyl group and/or silanol group and hydrosilylation. |